INDIUM 8.9 Solder Paste

INDIUM 8.9 Solder Paste View Large Image
8.9

Indium8.9 is an air or nitrogen reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by the electronics industry to replace conventional Pb-bearing solders.

Indium8.9 offers unprecedented stencil print transfer efficiency to work in the broadest range of processes. In addition, the high probe testability of Indium8.9 minimizes false failures in ICT.

Features:

  • Strong oxidation barrier to promote coalescence after heat exposure
  • High tackiness to maintain contact with components
  • Clear probe-testable flux residue



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