INDIUM 8.9 Solder Paste

INDIUM 8.9 Solder Paste View Large Image

Indium8.9 is an air or nitrogen reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by the electronics industry to replace conventional Pb-bearing solders.

Indium8.9 offers unprecedented stencil print transfer efficiency to work in the broadest range of processes. In addition, the high probe testability of Indium8.9 minimizes false failures in ICT.


  • Strong oxidation barrier to promote coalescence after heat exposure
  • High tackiness to maintain contact with components
  • Clear probe-testable flux residue

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